Effect of Indium on Wettability of Sn-2Ag-0,5Cu-1In Quaternary Solder Alloy on Cu Substrate

Authors : Okan Uyanik, Ahmet Mustafa Erer, Yunus Türen

Pages : 1-7

Doi:10.31202/ecjse.441434

View : 10 | Download : 5

Publication Date : 2019-01-31

Article Type : Research

Abstract :This study reports the investigation on indium addition into Sn–3Ag-0.5Cu ternary lead-free solder to improve its various performances. The effects of indium addition on wettability of the solder alloy was studied. The results showed that when the addition of indium was 1 wt.%, the change in melting temperature of Sn–2Ag-0.5Cu–1In solder was negligible, but the contact angles (θ) of the solder alloy decreased which were measured by using of the sessile drop method at various temperatures (250, 280 and 310 °C) on Cu substrate in Ar atmosphere.  Microstructures, inter-metallic phases, and melting temperatures of alloys were characterized by optic microscope and scanning electron microscope and energy dispersive X-ray spectroscopy, X-ray diffraction, and differential scanning calorimeter, and effects of the amount of In on microstructure were investigated. The lowest θ was obtained as 35,55°for Sn–2Ag-0.5Cu–1In  alloy at 310 °C.  The formation of intermetallic compounds (IMC) between the Pb-free solder alloys and the Cu substrate was observed. As a result, the studies show that the wetting capability of Sn–2Ag-0.5Cu–1In quaternary alloy is better than Sn–3Ag-0.5Cu ternary alloy.
Keywords : Islatabilirlik, Kurşunsuz Lehim Alaşımları, Temas Açısı