Production of WCu electrical contact material via conventional powder metallurgy method: Characterization, mechanical and electrical properties

Authors : Ali Erçetin, Kubilay Aslantaş

Pages : 37-42

View : 20 | Download : 10

Publication Date : 2017-10-05

Article Type : Research

Abstract :Normal 0 21 false false false TR X-NONE X-NONE      /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Normal Tablo"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-priority:99; mso-style-parent:""; mso-padding-alt:0cm 5.4pt 0cm 5.4pt; mso-para-margin-top:0cm; mso-para-margin-right:0cm; mso-para-margin-bottom:10.0pt; mso-para-margin-left:0cm; line-height:115%; mso-pagination:widow-orphan; font-size:11.0pt; font-family:"Calibri",sans-serif; mso-ascii-font-family:Calibri; mso-ascii-theme-font:minor-latin; mso-hansi-font-family:Calibri; mso-hansi-theme-font:minor-latin; mso-bidi-font-family:"Times New Roman"; mso-bidi-theme-font:minor-bidi; mso-fareast-language:EN-US;} In this study, the effects of increase of sintering temperature and Cu amount on microstructure, mechanical and electrical properties of WCu electrical contact materials fabricated via conventional powder metallurgy (P/M) method were investigated. The powders obtained by adding copper at different ratios into the tungsten powders were cold pressed in a mold under 60 MPa pressure. Samples were sintered at 1000 o C and 1100 o C using three different compositions ( W-%10wtCu, W-%20wtCu- and W-%30wtCu ). Microstructures of the samples were investigated by scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDX) and x-ray diffraction (XRD) analysis. Mechanical properties were determined by measuring hardness values and electrical properties were determined by measuring electrical resistivity. When the effect of the copper ratio on the microstructure, mechanical and electrical properties is analyzed, the reduction in the amount of copper has a positive effect on the hardness, while the electrical conductivity is adversely affected. In addition, the application of the sintering temperature above the melting temperature of copper has been effective in increasing the hardness and electrical conductivity values.
Keywords : Powder metallurgy, tungsten-copper, microstructure, hardness