- European Oral Research
- Vol: 57 Issue: 2
- Evaluation of the effects of thermal changes on the bond strength between zirconia framework and ven...
Evaluation of the effects of thermal changes on the bond strength between zirconia framework and veneering ceramic during the firing process
Authors : Yeşim Ölçer Us, Betül Tuncelli
Pages : 108-114
Doi:10.26650/eor.2023978293
View : 20 | Download : 52
Publication Date : 2023-05-31
Article Type : Research Article
Abstract :Purpose The aim of this in-vitro study was to evaluate the effect of thermal changes to shear bond strength during the firing process of veneering porcelain on a zirconia framework. Materials and Methods Single yttria-stabilized tetragonal zirconia polycrystal (Y-TZP) framework ceramic (Kavo Dental GmbH) and three different types of veneering ceramics (IPS e.max Ceram, Vita VM9, and GC Initial Zr-FS) were used. One-hundred-twenty standard disc-shaped samples were prepared from zirconia blocks by using a CAD/CAM system (Kavo Everest). Four different cooling processes (maximum, 25°C/min, 50°C/min and 75°C/min) were applied to the veneering ceramics and the shear bond strength (SBS) test was performed. Ceramic surfaces were investigated by using scanning electron microscopeic (SEM). The possible occurrence of a t–m transformation of zirconia was evaluated by X-Ray Diffraction (XRD). Two-way analysis of variance, Bonferroni correction and paired comparisons were used for statistical analysis. Results The main effects of veneering ceramics on shear bond strength were found to be significant (p=0.042). The mean shear bond strength values differ according to the cooling process (p<0.001). The monoclinic phase ratio increased in groups with fast cooling process. Conclusion The thermal changes during the firing process of veneering porcelain on a zirconia framework influenced the shear bond strength of the all-ceramic bilayered system. A slow cooling process provided higher strength for bilayer ceramic samples.Keywords : Zirconia, Veneering ceramic, CAD/CAM, Bond strength, Cooling process