- Turkish Journal of Electrical Engineering and Computer Science
- Vol: 26 Issue: 4
- A novel efficient TSV built-in test for stacked 3D ICs
A novel efficient TSV built-in test for stacked 3D ICs
Authors : Badi Guibane, Belgacem Hamdi, Brahim Ben Salem, Abdellatif Mtibaa
Pages : 1909-1921
View : 6 | Download : 1
Publication Date : 9999-12-31
Article Type : Makaleler
Abstract :A through-silicon via (TSV) is established as the main enabler for a three-dimensional integrated circuit (3D IC) that increases system density and compactness. The exponential increase in TSV density led to TSV-induced catastrophic and parametric faults. We propose an original architecture that detects errors caused by TSV manufacturing defects. The proposed design for testability is a built-in technique that detects errors in an early manufacturing stage and is hence very economically attractive. The proposal is capable of testing each and every TSV in the network. The technique achieves high fault coverage and high observability.Keywords : 3D IC, through-silicon via, built-in current sensor, built-in self-test, design for testability, test access mechanism